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Pc building simulator 2 radiators1/22/2024 I have a second DDC pump and I figure I can use that. That is going to free up some space and hopefully some flow restriction. Also, when I change things around, I'm going to get rid of the distroplate and get a dual DDC pump top and use a standard tubular reservoir. I mean, I could hammer a thick one in there, but I don't want to shell out any more cash that I have to. At the time I got the 5950x, I did it just to squeeze all the performance I can out of the CPU as it was msrp $800 at that time and I wanted to get my money's worth, but it seems overkill now.Īs for the extra radiator, do you have a recommendation for another one I could use that is slim if I could mount it as exhaust like the other two? I didn't realize the XR5 was so restrictive, thanks for pointing that out. I've been thinking of doing this as I don't really need the juice and the heat isn't worth it. I may roll back to just standard auto setting though. I looked it up and I have -5mv on all cores in CCD1 and -10mv in CCD2. It will also limit your airflow into the case by quite a bit.Ĭlick to expand.I'm actually using the curve optimizer. A slim radiator will probably bring the air temp by something between 1/2 and 2/3 of the delta between air and water. You will also be heating up the air for your other radiators. The XR7s are HW-labs LX which has medium restriction, but the 360 edition of the XR5 has more than twice the restriction of your 360 XR7 at 1gpm. The XR5 is very similar to a hw-labs GTS, if not the same, which has very high restriction (probably about the same or more than your CPU waterblock). Curve optimizer is the way to go if you want to OC a ryzen 5000 CPU, otherwise PB will be equally good in 99% of tasks. Even with oversized cooling the difference in performance with PBO vs PB will be 5-6% at best and a slight loss at worst. Personally I would either do a full curve optimizer or leave it at plain PB. Out of curiosity, which use cases do you need PBO for outside of benchmarks? For games, plain PBO doesn't do much as few if any games reach the PB limits. It will also limit your airflow into the case by quite a bit. So if you lower your PPT to 199, you'll reduce your package temp to 85.Ĭlick to expand.I would say no. If your water is at 37.5 and your CPU is at 90, then the delta is 52.5. Since it looks like you can't easily add more rad space, I would dial down the power limits on the CPU to get those 5 degrees back and then call it a day. My guess is that your temps are getting too high under combined loads, and it's pushing the IOD off the brink of stability. You're also running 4 dual-rank sticks at 3600, which is a heavy load for the IOD. You can't necessarily run the chip just as hard as you did before if it's 5C hotter. My overall impression is that you're just pushing your chip a little too hard for the current state of your cooling. Hopefully you already knew that going in. So that would make you run 5 degrees hotter under a combined CPU GPU load than you did before you brought the GPU and addl' 240 rad into the mix. So if your delta is 12.5C now, that means it was 7.6 before. In doing so, you went from 73.3 watts per 120mm to 120 watts per 120mm, so your air to water delta under combined load will be 63% higher than before based on that factor alone. You did go from 220W into 3x120mm rad space to 600W into 5x120 rad space. If you just use straight distilled water you are going to get much more air caught in the system. With some systems it clears out on it's own over time, but with others depending on the loop and how easy it is for freed bubbles to get sucked back in, it doesn't and needs lots of case movementĢ.) What do you use as your coolant? Air bubble problems are a lot less rare if you use a coolant that contains a good surfactant. This is usually necessary to get all the air out of the system. You can keep tilting and banging the system around for hours and still not get all the air out. It sounds to me like your issue may be that you still have air trapped in the system.ġ.) Did you do "case gymnastics" after your fill? Varying pump speed up and down and leaning the case on its sides and front and back up again, while the pump is running to try to get all the air out. There really should not be bubbles moving around inside your loop after the system hits stability after being filled.
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